Open Source & Materials

Course materials for 《物联网导论》/ Introduction to Internet of Things are available here.

《移动应用开发》/ LLM-enhanced Mobile App Development are available here.

Some thoughts on paper writing for students in our group are available here.

gr-lora: The first open-source implementation of real-time LoRa PHY collision decoding.

LoRaPHY: A complete MATLAB implementation of LoRa physical layer.

CityWAN: Dataset and codebase for city-scale LoRa network measurement, analysis, and evaluation.

Some thoughts on learning programming in the era of AI here.

Books

《物联网通信与智能感知 理论与实践》封面

《物联网通信与智能感知 理论与实践》:从物联网的基础知识出发,围绕物联网通信和感知展开,全面介绍了物联网的架构、技术原理、应用领域和发展趋势等,涵盖感知层、网络层和应用层等多个层次,为读者提供了完整的物联网知识体系。

News

    课题组招收硕士、博士生、博士后。Currently, I am looking for self-motivated undergraduate/MPhil/PhD students and PostDocs.

  • Jiliang Wang is the director of Tsinghua University (School of Software)-Hebang Biotechnology Joint Research Center for Industrial Artificial Intelligence and Smart Interconnection.
  • [10/2025] Our work is accepted by MobiCom 2025.
  • [01/2025] 博士生童率获得 CCF 博士论文激励计划
  • [01/2025] We are organizing TIOT Special issue on LLM Empowered Internet of Things. Consider submit your work to the SI.
  • [11/2023] Our work on large-scale LoRa network measurement won the ACM SenSys 2023 Best Paper Award Runner-up.

Professional Activities

Conference Organization Committee

  • Publicity Chair, ACM MobiCom 2024, ACM MobiSys 2024, ACM SenSys 2026, IEEE SECON 2020
  • Workshop Chair, ACM MobiSys 2025
  • Demo Chair, ACM UbiComp 2026
  • Artifact Evaluation Chair, ACM MobiCom 2025
  • Track Chair, IEEE MSN 2023
  • Local Arrangement Chair, EWSN 2019
  • Publication Chair, ACM TURC 2017, 2018, 2019, 2020, 2021, 2023, 2026
  • ...

Technical Program Committee

  • ACM MobiCom 2026
  • ACM SenSys 2024, 2025
  • IEEE INFOCOM 2016, 2017, 2018, 2019, 2020, 2021, 2022
  • IEEE ICDCS 2019, 2020, 2024, 2025, 2026
  • IEEE SECON 2017, 2018, 2019, 2023, 2024, 2026
  • IEEE MASS 2014, 2019, 2020, 2022, 2023, 2024, 2025
  • IEEE ICCCN 2018, 2019
  • ...